Number of layers
2 - 4 - 6 - 8
Basic Material
FR4
18, 35, 70, 105 µm
FR4 std. Tg130-140°C, Mid Tg150°C, High Tg>170° C
CTI> 175
CTI> 400
Halogen-free base material
Other materials on request
Thickness
DF = mini 0,50 mm - max 3,20 mm
MS = mini 0,45 mm - max 2,40 mm
Max. working panel
DF = 639 x 560 mm
MS= 620 x 510 mm
Finishings
HAL
Sn 63% Pb 37%
1÷30 µm
HAL Lead Free
SACX 0307
1÷30 µm
Chemical gold (ENIG)
Duraposit SMT88
Ni 3÷6 µm Au 0,05÷0,15 µm
Chemical tin
Stannatech
0,80÷1,20 µm
OSP
Entek Plus 106AX
0,15÷0,45 µm
Solder Mask
PROBIMER 77
Other finishings
Screen printing components
Via hole plugging
Graphite
Peelable mask
Min hole diameter (finished hole)
0,2 mm
Trace/Isolation
DS = ≥100 µm
ML= ≥100 µm
AOI on internal/external layers
Mechanics
Scoring, milling
Final check
Electrical test, visual inspection

Installed production capacity

(production 24/24 hours on 3 shifts - 6/7 days)

  • 500 m2/day 
  • 16.000 m2/month (approx.)
  • 180.000 m2/year (approx.)