EUROPA
ASIA
Nr. of Layers

<=32

<=60

Technologies

PCB Rigid/Semi-flex/Rigid-flex/Flex/HDI

PCB Rigid/Semi-flex/Rigid-flex/Flex/HDI

Base Material

FR4, Metal Core, Arlon, Halogen-free, Rogers, PTFE, PI, etc.

Other materials Available upon request

FR4. Metal Core, Arlon, Taconic, Nelco, Isola Halogen-free, Rogers, PTFE, PI, etc.

Other materials upon request

Board Thickness

Max 6,5 mm

DS = min 0.1 mm max 10 mm
ML= min 0.3 mm max 10 mm

Maximum Panel Size

431 X 558 mm

1200 X 572 mm

Finishing

Nickel Gold – SnPb HASL – Pb-free HASL – Electrolytic
Nickel – Immersion NiAu – Electrolytic Gold – OSP –
Immersion Tin – Immersion Silver – Nickel Palladium Gold

HASL, Lead free HASL
ENIG (+G/F), Immersion Silver, Immersion Tin,
Passivated Copper (OSP), ENEPIG HARD GOLD

Solder Mask

Available upon request

Available upon request

Additional Features

PTH
PTH in pad
Blind via
Buried via
Microvia
Unplated holes

Resin-filled plating (IPC 4761 Type VII);
Component silkscreen
Via hole plugging; Embedded copper
Graphite, peelable mask; Laser drilling
Serialization; Blind/Buried vias
Others upon reques

Minimum Drill Diameter (finished hole)

0.7 Mm (Hole tolerance ± 2 mil)

0.1 Mm (Hole tolerance +/-2mil)
Plated hole tolerance: +/- 0.0762mm
Press-fit holes: +/- 0.05mm
Non-plated hole tolerance: +/- 0.05mm

Trace/Isolation

50/50 µm min. trace/isolation
200 µm BGA pitch

50/50 µm min Trace/Isolation
200 µm BGA pitch

Mechanical Processing

Scoring, milling, punching, 
laser drilling, back drilling

Scoring, milling, punching, 
laser drilling, back drilling

Final Inspection

IN OMR

IN OMR

FÄHIGKEITSPROTOTYPEN

Schneller Erhalt von Mustern kann in Test- und Validierungsprozessen entscheidend sein.
Deshalb arbeiten wir mit vertrauenswürdigen Partnern zusammen, um schnelle und zuverlässige Lieferungen zu gewährleisten,
wobei wir alle Überwachungsaktivitäten intern steuern.

PROTOTYPEN EUROPA

FR4: 2–7 Arbeitstage
HDI: 7–10 Arbeitstage
FLEX/RIGID-FLEX: 10 Arbeitstage