Number of layers
2 - 4 - 6 - 8
<=32
Basic Material
FR4
18, 35, 70, 105 µm
FR4 std. Tg130-140°C; Mid Tg 150°C; High Tg>170°C
CTI>175 CTI>400
Halogen-free base material
Other materials on request
FR4. Metal Core, Arlon, Taconic, Nelco, Isola Halogen-free, Rogers, PTFE, PI, etc.
Other materials on request
PCB thickness
DS= min 1mm – max 3,20mm
ML= min 1mm – max 2,40mm
DS= min 0.1mm max 10mm
ML= min 0.3mm max 10mm
Max. working panel
DS= 639 X 560 mm
ML= 620 X 510 mm
1200X572mm
Finishings
HAL Lead Free
SACX 0307
1÷30 µm
Chemical gold (ENIG)
Duraposit SMT88
Ni 3÷6 µm Au 0,05÷0,15 µm
Chemical tin
Stannatech
0,80÷1,20 µm
OPS
Entek Plus 106A
0,2÷0,15 µm
HASL, Lead free HASL
ENIG (+G/F), Immersion silver/Tin OSP, ENEPIG, bare copper,
HARD GOLD
Solder Mask
Probimer 77 + Imagecure XV501T
On request
Other finishings
Screen printing components
Vias hole occlusion
Graphite
Peelable mask
Plating over via resin filling (IPC 4761 type VII)
Screen printing components
Vias hole occlusion, Copper in-lay
Graphite, Peelable mask, Laser routing
Serial number, blind/buried vias
Others on request
Minimum bore diameter (finished hole)
0,2 mm
0.1 Mm (Drill tolerance +/-2mil)
Tolerance PTH: +/- 0.0762mm
Pressing fit hole: +/- 0.05mm
NPTH: +/- 0.05mm
Trace/Isolation
DS=> 100 µm
ML=> 100 µm
AOI on internal/external layers
50/50 µm min line width/space
200 µm BGA pitch
Mechanics
Scoring, milling
Scoring, milling, punching, Laser drilling, Back drilling
Final check
Electrical test, visual inspection in OMR
Electrical test, visual inspection in OMR