Capability
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Layer count | 2 - 4 - 6 - 8 layers |
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| Base material |
FR4 FR4 std. Tg130-140°C, Mid Tg150°C, High Tg>170° C CTI> 175 Halogen free flame retardant Additional materials available upon request |
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| Final thickness |
DF = mini 0,50 mm - max 3,20 mm MS = mini 0,45 mm - max 2,40 mm |
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| Max. working panel size |
DF = 639 x 560 mm MS= 620 x 510 mm |
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| Finishings |
HAL HAL Lead Free Chemical GOLD (ENIG) Immersion tin OSP |
Sn 63% Pb 37% SACX 0307 Duraposit SMT88 Stannatech Entek Plus 106AX |
1÷30 µm 1÷30 µm Ni 3÷6 µm Au 0,05÷0,15 µm 0,80÷1,20 µm 0,15÷0,45 µm |
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| Solder Mask | PROBIMER 77 | |||
| Additional Inks |
Silkscreen Vias plugged Carbon pads Peelable mask |
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| Minimum hole (finished diameter) |
0,2 mm | |||
| Tracks / spacing |
DS = ≥125 µm ML= ≥125 µm AOI on internal / external layers |
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| Contour | Scoring, routing | |||
| Final Inspection | Visual, electrical test | |||
INSTALLED PRODUCTION CAPACITY(prod: 24/24 hours - 3 shifts - 6/7 days per week)
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